Thermal Management

Engineers at the University of Michigan, Ann Arbor, have developed a plastic blend that, they say, can dissipate heat up to 10 times better than its conventional counterparts. While plastics are inexpensive, lightweight, and flexible, they tend to restrict the flow of heat, so their use has been...

When designing devices, engineers often must join together materials that expand and contract at different rates as temperatures change. Such thermal differences can cause problems if, for instance, a semiconductor chip is plugged into a socket that can’t expand and contract rapidly enough to maintain an...

The MED-2955 from NuSil (Carpinteria, CA) is designed to have low volatility and low ionic content for more sensitive electronic devices or processes. It is non-cytotoxic and can be used as a cure-in-place adhesive or potting compound between electrical/electric components and heat sinks as part of a thermal management...

This design of the liquid-cooling garment for NASA spacesuits allows the suit to remove metabolic heat from the human body more effectively, thereby increasing comfort and performance while reducing system mass. The garment is also more flexible, with fewer restrictions on...