Electronics are tightly packaged into sealed enclosures in a variety of different applications, both industrial and military. From control cabinets in dusty factories, to cabinets aboard submarines, the combination of total power and environmentally sealed designs create a thermal challenge.
Designers want to achieve higher power densities while gaining efficiencies in packing and weight. However, how do you accomplish this without compromising the application’s lifespan or increasing the amount of maintenance required?
This 30-minute Webinar examines the fundamentals of cabinet cooling, with an emphasis on efficiency and reliability. The thermal technologies covered include sealed enclosure coolers, HiK™ Plate heatsinks, and loop thermosyphons. Additionally, solutions for real-world design challenges are presented.
An audience Q&A follows the technical presentations.