A University of Chicago research team has created a new solder for semiconductors. After being heated to several hundred degrees Celsius, the compounds of cadmium, lead, and bismuth can be applied as a liquid or paste to join two pieces of a semiconductor.

The liquid converts cleanly into a material that is compositionally matched to the bonded parts. After application as a liquid or paste, the molecules decompose to form a seamless joint.

The soldering technique enables 3D printing of semiconductors. Inexpensive semiconductors will improve technologies like solar cells, sensors, and flat image displays.


Medical Design Briefs Magazine

This article first appeared in the April, 2015 issue of Medical Design Briefs Magazine.

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