The MED-2955 from NuSil (Carpinteria, CA) is designed to have low volatility and low ionic content for more sensitive electronic devices or processes. It is non-cytotoxic and can be used as a cure-in-place adhesive or potting compound between electrical/electric components and heat sinks as part of a thermal management regime to keep medical devices operating at their optimal levels. Its low volatility makes it suitable for processing environments in which high heat and/or vacuum conditions require minimal contamination on adjacent parts. It is also suitable for hermetically or near hermetically sealed environments in which low volatility is required. It provides a thin bond line and low thermal resistance with a bulk thermal conductivity of 0.63 W/mK. It can be cured at low temperatures or be heat accelerated.

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Medical Design Briefs Magazine

This article first appeared in the April, 2011 issue of Medical Design Briefs Magazine.

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