The MED-2955 from NuSil (Carpinteria, CA) is designed to have low volatility and low ionic content for more sensitive electronic devices or processes. It is non-cytotoxic and can be used as a cure-in-place adhesive or potting compound between electrical/electric components and heat sinks as part of a thermal management regime to keep medical devices operating at their optimal levels. Its low volatility makes it suitable for processing environments in which high heat and/or vacuum conditions require minimal contamination on adjacent parts. It is also suitable for hermetically or near hermetically sealed environments in which low volatility is required. It provides a thin bond line and low thermal resistance with a bulk thermal conductivity of 0.63 W/mK. It can be cured at low temperatures or be heat accelerated.

For Free Info Click Here 


Medical Design Briefs Magazine

This article first appeared in the April, 2011 issue of Medical Design Briefs Magazine.

Read more articles from this issue here.

Read more articles from the archives here.