EpoxySet Inc., Lincoln, RI, has added EB-315 low thermal expansion epoxy to its line of low expansion/thermally conductive products. This versatile material can be used as an adhesive or encapsulant for semi-conductors and other microelectronics, a gasket sealing compound, wire bonder, or any application where temperature cycling between -55°C and 230°C is required.

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Medical Design Briefs Magazine

This article first appeared in the October, 2015 issue of Medical Design Briefs Magazine.

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