Mill-Max (Oyster Bay, NY) offers 804 and 805 Series interconnects, suitable for high pin count I/O and board-to-board applications. The triple row pin field allows for signal connections to be more densely packaged. Placing and soldering one connector rather than three SIP sockets or a single and double row combination increases assembly

efficiency and improves positional accuracy. The triple row package, on a .100" (2.54 mm) grid, is available from 9 to 96 position configurations. The connectors are RoHS compliant and feature high temperature thermoplastic insulators compatible with lead-free soldering temperature requirements.

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Medical Design Briefs Magazine

This article first appeared in the July, 2011 issue of Medical Design Briefs Magazine.

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