Master Bond Inc., Hackensack, NJ, formulated EP79FL with a silver- coated nickel filler, as a twopart, electrically conductive epoxy for bonding, sealing, and coating applications. It has low volume resistivity of less than 0.005 ohmcm and is suitable for use in the electronic, semiconductor and electro-optic industries.

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Medical Design Briefs Magazine

This article first appeared in the January, 2014 issue of Medical Design Briefs Magazine (Vol. 4 No. 1).

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