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Remtec, Bristol, RI, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of its parent company, LTI. Additional engineering capabilities include a variety of assembly operations, such as standard SMT soldering, gold tin soldering, and CuSil brazing. Typical attachment components are lead-frames, pins, bushings, contacts, connectors, and lugs, as well as Kovar and ceramic ring frames for hermetic assembly. With the combined capabilities of both companies, Remtec can offer sensor designers a number of interrelated metallization technologies, including thick and thin films, PCTF® metallization, and AgENIG® (Electroless Ni-Immersion Au over thick film Ag).

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